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CIC Copper Cladded Steel Foil

Home EXTENSIONS CIC Copper Cladded Steel Foil
CIC Copper Cladded Steel Foil

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  • Description
  • Process
  • Packing Details
  • Tags

Description

CIC(Copper-Invar™-Copper) Foil

CIC foil is used for printed circuit boards with ground and power planes and metal cores. The low CTE(coefficient of thermal expansion)over a broad temperature range (-55℃-125℃) is crucial for aerospace and some special fields.

 

 

Structure:

Material

Thickness (%)

Cu | FeNi36 | Cu

12.5% | 75% | 12.5%

Capacity:
Density: 8.33g/cm³
Thermal conductivity: 1.10(xy plane);0.19(z plane)W cm/cm²℃
Electrical conductivity: 14.5 m/Ω mm² (20℃,soft annealed)
Electrical Resistivity: 0.069 m/Ω mm² (20℃,soft annealed)
Modulus of Elasticity: 140000 N/mm²
CTE(Coefficient of thermal expansion): 2.4 to 5.6 ppm/℃ annealed condition longitudinal

Specification:

Item

Unit

Size

Thickness

mm

0.035

0.05

0.075

>0.1

Width

mm

1-600

1-600

1-600

1-600

Thickness tolerance

±10%

±10%

±10%

±10%

Width tolerance

mm

±1.0

±1.0

±1.0

±1.0

Process

Packing Details

Tags

Beryllium Foil, Copper Foil, Copper Foil Tape RA Copper Foil, HP Brass Foil, RA Brass Foil, RA Bronze Foil, RA Foils for FPC, RA Foils for Li-ion Battery, Rolled Copper Foil, Tinned Copper Foil, Treated Copper Foil, Treated RA Foils for FPCTags

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+86 21 5635 1345
+86 21 61740338
sales@civen.cn

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+86 21 5635 1345
+86 21 61740338
sales@civen.cn

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