Description
CIC(Copper-Invar™-Copper) Foil
CIC foil is used for printed circuit boards with ground and power planes and metal cores. The low CTE(coefficient of thermal expansion)over a broad temperature range (-55℃-125℃) is crucial for aerospace and some special fields.
Structure：
|
Material |
Thickness (%) |
|
Cu | FeNi36 | Cu |
12.5% | 75% | 12.5% |
Capacity：
Density: 8.33g/cm³
Thermal conductivity: 1.10(xy plane)；0.19(z plane)W cm/cm²℃
Electrical conductivity: 14.5 m/Ω mm² (20℃,soft annealed)
Electrical Resistivity: 0.069 m/Ω mm² (20℃,soft annealed)
Modulus of Elasticity: 140000 N/mm²
CTE（Coefficient of thermal expansion）: 2.4 to 5.6 ppm/℃ annealed condition longitudinal
Specification：
|
Item |
Unit |
Size |
|||
|
Thickness |
mm |
0.035 |
0.05 |
0.075 |
>0.1 |
|
Width |
mm |
1-600 |
1-600 |
1-600 |
1-600 |
|
Thickness tolerance |
±10% |
±10% |
±10% |
±10% |
|
|
Width tolerance |
mm |
±1.0 |
±1.0 |
±1.0 |
±1.0 |
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