Description
CIC(Copper-Invar™-Copper) Foil
CIC foil is used for printed circuit boards with ground and power planes and metal cores. The low CTE(coefficient of thermal expansion)over a broad temperature range (-55℃-125℃) is crucial for aerospace and some special fields.
Structure:
Material |
Thickness (%) |
Cu | FeNi36 | Cu |
12.5% | 75% | 12.5% |
Capacity:
Density: 8.33g/cm³
Thermal conductivity: 1.10(xy plane);0.19(z plane)W cm/cm²℃
Electrical conductivity: 14.5 m/Ω mm² (20℃,soft annealed)
Electrical Resistivity: 0.069 m/Ω mm² (20℃,soft annealed)
Modulus of Elasticity: 140000 N/mm²
CTE(Coefficient of thermal expansion): 2.4 to 5.6 ppm/℃ annealed condition longitudinal
Specification:
Item |
Unit |
Size |
|||
Thickness |
mm |
0.035 |
0.05 |
0.075 |
>0.1 |
Width |
mm |
1-600 |
1-600 |
1-600 |
1-600 |
Thickness tolerance |
±10% |
±10% |
±10% |
±10% |
|
Width tolerance |
mm |
±1.0 |
±1.0 |
±1.0 |
±1.0 |