Description
Copper Strip for Lead Frames
The material for lead frame is always made from alloy of copper, Iron and phosphorus, or copper, nickel and silicon, which have the common alloy No. of C192(KFC),C194 and C7025.These alloys have high strength and performance.C194 and KFC are most representative for copper, iron and phosphorus alloy, they are the most common alloy materials.
C7025 is the alloy of copper and phosphorus, silicon. It has high thermal conductivity and high flexibility, and do not need heat treatment, also it’s easy for stamping. It has high strength, excellent thermal conductivity properties, and very suitable for lead frames, especially for assembly of high density integrated circuits.
Main technical parameters:
Chemical composition
|
Name |
Alloy No. |
Chemical Composition(%) |
|||||
|
Fe |
P |
Ni |
Si |
Mg |
Cu |
||
|
Copper-Iron-Phosphorus |
QFe0.1/C192/KFC |
0.05-0.15 |
0.015-0.04 |
— |
— |
— |
Rem |
|
QFe2.5/C194 |
2.1-2.6 |
0.015-0.15 |
— |
— |
— |
Rem |
|
|
Copper-Nickel-Silicon |
C7025 |
—– |
—– |
2.2-4.2 |
0.25-1.2 |
0.05-0.3 |
Rem |
Technical Parameters
|
Alloy No. |
Temper |
Mechanical properties |
||||
|
Tensile Strength |
Elongation |
Hardness |
Elctricity Conductivity |
Thermal Conductivity |
||
|
C192/KFC/C19210 |
O |
260-340 |
≥30 |
＜100 |
85 |
365 |
|
1/2H |
290-440 |
≥15 |
100-140 |
|||
|
H |
340-540 |
≥4 |
110-170 |
|||
|
C194/C19410 |
1/2H |
360-430 |
≥5 |
110-140 |
60 |
260 |
|
H |
420-490 |
≥2 |
120-150 |
|||
|
EH |
460-590 |
—- |
140-170 |
|||
|
SH |
≥550 |
—- |
≥160 |
|||
|
C7025 |
TM02 |
640-750 |
≥10 |
180-240 |
45 |
180 |
|
TM03 |
680-780 |
≥5 |
200-250 |
|||
|
TM04 |
770-840 |
≥1 |
230-275 |
|||
Note: Above figures based on the material thickness 0.1~3.0mm.
Typical Applications:
Lead frame for Integrated Circuits, Electrical connectors, Transistors, LED stents.
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