Electrodeposited (ED) copper foil is the invisible backbone of modern electronics. Its ultra-thin profile, high ductility, and excellent conductivity make it essential in lithium batteries, PCBs, and flexible electronics. Unlike rolled copper foil, which relies on mechanical deformation, ED copper foil is produced by electrochemical deposition, achieving atomic-level control and performance customization. This article unveils the precision behind its production and how process innovations are transforming industries.
I. Standardized Production: Precision in Electrochemical Engineering
1. Electrolyte Preparation: A Nano-Optimized Formula
The base electrolyte consists of high-purity copper sulfate (80–120g/L Cu²⁺) and sulfuric acid (80–150g/L H₂SO₄), with gelatin and thiourea added at ppm levels. Advanced DCS systems manage temperature (45–55°C), flow rate (10–15 m³/h), and pH (0.8–1.5) with precision. Additives adsorb to the cathode to guide nano-level grain formation and inhibit defects.
2. Foil Deposition: Atomic Precision in Action
In electrolytic cells with titanium cathode rolls (Ra ≤ 0.1μm) and lead alloy anodes, 3000–5000 A/m² DC current drives copper ion deposition on the cathode surface in (220) orientation. Foil thickness (6–70μm) is precisely tuned via roll speed (5–20 m/min) and current adjustments, achieving ±3% thickness control. The thinnest foil can reach 4μm—1/20th the thickness of a human hair.
3. Washing: Ultra-Clean Surfaces with Pure Water
A three-stage reverse rinsing system removes all residue: Stage 1 uses pure water (≤5μS/cm), Stage 2 applies ultrasonic waves (40kHz) to dislodge organic traces, and Stage 3 uses heated air (80–100°C) for spot-free drying. This results in copper foil with oxygen levels <100ppm and sulfur residues <0.5μg/cm².
4. Slitting and Packaging: Precision to the Final Micron
High-speed slitting machines with laser edge control ensure width tolerances within ±0.05mm. Vacuum anti-oxidation packaging with humidity indicators preserves surface quality during transport and storage.
II. Surface Treatment Customization: Unlocking Industry-Specific Performance
1. Roughening Treatments: Micro-Anchoring for Enhanced Bonding
Nodule Treatment: Pulse plating in CuSO₄-H₂SO₄-As₂O₃ solution creates 2–5μm nodules on the foil surface, improving adhesion strength to 1.8–2.5N/mm—ideal for 5G circuit boards.
Dual-Peak Roughening: Micro- and nano-scale copper particles increase surface area by 300%, improving slurry adhesion in lithium battery anodes by 40%.
2. Functional Plating: Molecular-Scale Armor for Durability
Zinc/Tin Plating: A 0.1–0.3μm metal layer extends salt spray resistance from 4 to 240 hours, making it a go-to for EV battery tabs.
Nickel-Cobalt Alloy Coating: Pulse-plated nano-grain layers (≤50nm) achieve HV350 hardness, supporting bendable substrates for foldable smartphones.
3. High-Temperature Resistance: Surviving the Extreme
Sol-gel SiO₂-Al₂O₃ coatings (100–200nm) help foil resist oxidation at 400°C (oxidation <1mg/cm²), making it a perfect match for aerospace wiring systems.
III. Empowering Three Major Industrial Frontiers
1. New Energy Batteries
CIVEN METAL’s 3.5μm foil (≥200MPa tensile, ≥3% elongation) increases 18650 battery energy density by 15%. Custom perforated foil (30–50% porosity) helps prevent lithium dendrite formation in solid-state batteries.
2. Advanced PCBs
Low-profile (LP) foil with Rz ≤1.5μm reduces signal loss in 5G millimeter-wave boards by 20%. Ultra-low profile (VLP) foil with reverse-treated finish (RTF) supports data rates of 100Gb/s.
3. Flexible Electronics
Annealed ED copper foil (≥20% elongation) laminated with PI films withstands over 200,000 bends (1mm radius), acting as the “flexible skeleton” of wearables.
IV. CIVEN METAL: The Customization Leader in ED Copper Foil
As a quiet powerhouse in ED copper foil, CIVEN METAL has built an agile, modular manufacturing system:
Nano-Additive Library: Over 200 additive combinations tailored for high tensile strength, elongation, and thermal stability.
AI-Guided Foil Production: AI-optimized parameters ensure ±1.5% thickness accuracy and ≤2I flatness.
Surface Treatment Hub: 12 dedicated lines offering 20+ customizable options (roughening, plating, coatings).
Cost Innovation: In-line waste recovery boosts raw copper utilization to 99.8%, reducing custom foil costs by 10–15% below market average.
From atomic lattice control to macro-scale performance tuning, ED copper foil represents a new era of material engineering. As the global shift toward electrification and smart devices accelerates, CIVEN METAL leads the charge with its “atomic precision + application innovation” model—pushing China’s advanced manufacturing toward the top of the global value chain.
Post time: Jun-03-2025