100% Original Copper Foil Sheet Adhesive Backed - HTE Electrodeposited Copper Foils for PCB – CIVEN
100% Original Copper Foil Sheet Adhesive Backed - HTE Electrodeposited Copper Foils for PCB – CIVEN Detail:
Product Introduction
The electrolytic copper foil produced by CIVEN METAL has excellent resistance to high temperatures and high ductility. The copper foil does not oxidize or change color at high temperatures, and its good ductility makes it easy to laminate with other materials. The copper foil produced by the electrolysis process has a very clean surface and a flat sheet shape. The copper foil itself is roughened on one side, which makes it easier to adhere to other materials. The overall purity of the copper foil is very high, and it has excellent electrical and thermal conductivity. In order to meet the needs of our customers, we can provide not only rolls of copper foil, but also customized slicing services.
Specifications
Thickness: 1/4OZ～20OZ(9µm～70µm)
Width: 550mm ～1295mm
Performance
The product has excellent room temperature storage performance, high temperature oxidation resistance performance, product quality to meet the IPC-4562 standard Ⅱ, Ⅲ level requirements.
Applications
Suitable for all kinds of resin system of double-sided, multilayer printed circuit board.
Advantages
The product adopts a special surface treatment process to improve the product’s ability to resist bottom corrosion and reduce the risk of copper residue.
Performance(GB/T5230-2000、IPC-4562-2000)
|
Classification |
Unit |
1/4OZ (9μm) |
1/3OZ (12μm) |
J OZ (15μm) |
1/2OZ (18μm) |
1OZ (35μm) |
2OZ (70μm) |
|
|
Cu Content |
% |
≥99.8 |
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|
Area Weigth |
g/m2 |
80±3 |
107±3 |
127±4 |
153±5 |
283±5 |
585±10 |
|
|
Tensile Strength |
R.T.(25℃) |
Kg/mm2 |
≥28 |
≥30 |
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|
H.T.(180℃) |
≥15 |
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|
Elongation |
R.T.(25℃) |
% |
≥4.0 |
≥5.0 |
≥6.0 |
≥10 |
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|
H.T.(180℃) |
≥4.0 |
≥5.0 |
≥6.0 |
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|
Roughness |
Shiny(Ra) |
μm |
≤0.4 |
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|
Matte(Rz) |
≤5.0 |
≤6.0 |
≤7.0 |
≤7.0 |
≤9.0 |
≤14 |
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|
Peel Strength |
R.T.(23℃) |
Kg/cm |
≥1.0 |
≥1.2 |
≥1.2 |
≥1.3 |
≥1.8 |
≥2.0 |
|
Degraded rate of HCΦ(18%-1hr/25℃) |
% |
≤5.0 |
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|
Change of color(E-1.0hr/190℃) |
% |
Good |
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|
Solder Floating 290℃ |
Sec. |
≥20 |
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|
Pinhole |
EA |
Zero |
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|
Preperg |
—- |
FR-4 |
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Note: 1. The Rz value of copper foil gross surface is the test stable value, not a guaranteed value.
2. Peel strength is the standard FR-4 board test value (5 sheets of 7628PP).
3. Quality assurance period is 90 days from the date of receipt.
Product detail pictures:
Related Product Guide:
Sticking to the belief of "Creating products of high quality and making friends with people from all over the world", we always put the interest of customers in the first place for 100% Original Copper Foil Sheet Adhesive Backed - HTE Electrodeposited Copper Foils for PCB – CIVEN , The product will supply to all over the world, such as: Hungary, Algeria, Madras, We strongly believe that technology and service is our base today and quality will create our reliable walls of future. Only we have better and better quality , could we achieve our customers and ourselves, too. Welcome customers all over the word to contact us for getting further business and reliable relationships. We are always here working for your demands whenever you need.
By Naomi from Jamaica - 2018.09.21 11:44
This manufacturers not only respected our choice and requirements, but also gave us a lot of good suggestions, ultimately， we successfully completed the procurement tasks.
By Evelyn from Argentina - 2017.10.23 10:29
