Shielded ED Copper Foils

Short Description:

STD standard copper foil produced by CIVEN METAL not only has good electrical conductivity because of the high purity of copper, but also is easy to etch and can effectively shield electromagnetic signals and microwave interference. The electrolytic production process allows for a maximum width of 1.2 meters or more, allowing for flexible applications in a wide range of fields. The copper foil itself has a very flat shape and can be perfectly molded to other materials. The copper foil is also resistant to high-temperature oxidation and corrosion, making it suitable for use in harsh environments or for products with strict material life requirements.

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Product Detail

Product Tags

Product Introduction

Specifications

CIVEN can provide 1/3oz-4oz (nominal thickness 12μm -140μm) shielding electrolytic copper foil with a maximum width of 1290mm, or various specifications of shielding electrolytic copper foil with a thickness of 12μm -140μm according to customer requirements with product quality meeting the requirements of IPC-4562 standard II and III.

Performance

It not only has the excellent physical properties of equiaxial fine crystal, low profile, high strength and high elongation, but also has good moisture resistance, chemical resistance, thermal conductivity and UV resistance, and is suitable for preventing interference with static electricity and suppressing electromagnetic waves, etc.

Applications

Suitable for automotive, electric power, communications, military, aerospace and other high-power circuit board, high-frequency board manufacturing, and transformers, cables, cell phones, computers, medical, aerospace, military and other electronic products shielding.

Advantages

1、Because of the special process of our roughening surface, it can effectively prevent the electrical breakdown.
2、Because the grain structure of our products is equiaxed fine crystal spherical, it shortens the time of line etching and improves the problem of uneven line side etching.
3, while having high peel strength, no copper powder transfer, clear graphics PCB manufacturing performance.

Performance(GB/T5230-2000、IPC-4562-2000)

Classification		Unit	9μm	12μm	18μm	35μm	50μm	70μm	105μm
Cu Content		%	≥99.8
Area Weigth		g/m²	80±3	107±3	153±5	283±7	440±8	585±10	875±15
Tensile Strength	R.T.(23℃)	Kg/mm²	≥28
	H.T.(180℃)		≥15			≥18	≥20
Elongation	R.T.(23℃)	%	≥5.0		≥6.0	≥10
	H.T.(180℃)		≥6.0			≥8.0
Roughness	Shiny(Ra)	μm	≤0.43
	Matte(Rz)		≤3.5
Peel Strength	R.T.(23℃)	Kg/cm	≥0.77	≥0.8	≥0.9	≥1.0	≥1.0	≥1.5	≥2.0
Degraded rate of HCΦ(18%-1hr/25℃)		%	≤7.0
Change of color(E-1.0hr/200℃)		%	Good
Solder Floating 290℃		Sec.	≥20
Appearance(Spot and copper powder)		----	None
Pinhole		EA	Zero
Size Tolerance	Width	0~2mm	0~2mm
	Length	----	----
Core		Mm/inch	Inside Diameter 76mm/3 inch