2021 China New Design Copper Insulation Tape - HTE Electrodeposited Copper Foils for PCB – CIVEN
2021 China New Design Copper Insulation Tape - HTE Electrodeposited Copper Foils for PCB – CIVEN Detail:
Product Introduction
The electrolytic copper foil produced by CIVEN METAL has excellent resistance to high temperatures and high ductility. The copper foil does not oxidize or change color at high temperatures, and its good ductility makes it easy to laminate with other materials. The copper foil produced by the electrolysis process has a very clean surface and a flat sheet shape. The copper foil itself is roughened on one side, which makes it easier to adhere to other materials. The overall purity of the copper foil is very high, and it has excellent electrical and thermal conductivity. In order to meet the needs of our customers, we can provide not only rolls of copper foil, but also customized slicing services.
Specifications
Thickness: 1/4OZ~20OZ(9µm~70µm)
Width: 550mm ~1295mm
Performance
The product has excellent room temperature storage performance, high temperature oxidation resistance performance, product quality to meet the IPC-4562 standard Ⅱ, Ⅲ level requirements.
Applications
Suitable for all kinds of resin system of double-sided, multilayer printed circuit board.
Advantages
The product adopts a special surface treatment process to improve the product’s ability to resist bottom corrosion and reduce the risk of copper residue.
Performance(GB/T5230-2000、IPC-4562-2000)
|
Classification |
Unit |
1/4OZ (9μm) |
1/3OZ (12μm) |
J OZ (15μm) |
1/2OZ (18μm) |
1OZ (35μm) |
2OZ (70μm) |
|
|
Cu Content |
% |
≥99.8 |
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|
Area Weigth |
g/m2 |
80±3 |
107±3 |
127±4 |
153±5 |
283±5 |
585±10 |
|
|
Tensile Strength |
R.T.(25℃) |
Kg/mm2 |
≥28 |
≥30 |
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|
H.T.(180℃) |
≥15 |
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|
Elongation |
R.T.(25℃) |
% |
≥4.0 |
≥5.0 |
≥6.0 |
≥10 |
||
|
H.T.(180℃) |
≥4.0 |
≥5.0 |
≥6.0 |
|||||
|
Roughness |
Shiny(Ra) |
μm |
≤0.4 |
|||||
|
Matte(Rz) |
≤5.0 |
≤6.0 |
≤7.0 |
≤7.0 |
≤9.0 |
≤14 |
||
|
Peel Strength |
R.T.(23℃) |
Kg/cm |
≥1.0 |
≥1.2 |
≥1.2 |
≥1.3 |
≥1.8 |
≥2.0 |
|
Degraded rate of HCΦ(18%-1hr/25℃) |
% |
≤5.0 |
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|
Change of color(E-1.0hr/190℃) |
% |
Good |
||||||
|
Solder Floating 290℃ |
Sec. |
≥20 |
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|
Pinhole |
EA |
Zero |
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|
Preperg |
—- |
FR-4 |
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Note: 1. The Rz value of copper foil gross surface is the test stable value, not a guaranteed value.
2. Peel strength is the standard FR-4 board test value (5 sheets of 7628PP).
3. Quality assurance period is 90 days from the date of receipt.
Product detail pictures:
Related Product Guide:
We thinks what clients think, the urgency of urgency to act from the interests of a client position of theory, allowing for greater quality, lessen processing costs, price ranges are much more reasonable, won the new and outdated shoppers the support and affirmation for 2021 China New Design Copper Insulation Tape - HTE Electrodeposited Copper Foils for PCB – CIVEN , The product will supply to all over the world, such as: Guyana, Austria, Georgia, Please really feel free to send us your requirements and we'll respond to you asap. We have got a professional engineering group to serve for your just about every detailed needs. Cost-free samples could be sent for you personally to understand much more information. In an effort to meet your requires, please really feel free to make contact with us. You may send us emails and contact us directly. Moreover, we welcome visits to our factory from around the globe for much better recognizing of our organization. nd items. In our trade with merchants of numerous countries, we usually adhere for the principle of equality and mutual benefit. It is actually our hope to market, by joint efforts, each trade and friendship to our mutual advantage. We look forward to getting your inquiries.
Managers are visionary, they have the idea of "mutual benefits, continuous improvement and innovation", we have a pleasant conversation and Cooperation.





