2021 China New Design Copper Insulation Tape - HTE Electrodeposited Copper Foils for PCB – CIVEN

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2021 China New Design Copper Insulation Tape - HTE Electrodeposited Copper Foils for PCB – CIVEN Detail:

Product Introduction

The electrolytic copper foil produced by CIVEN METAL has excellent resistance to high temperatures and high ductility. The copper foil does not oxidize or change color at high temperatures, and its good ductility makes it easy to laminate with other materials. The copper foil produced by the electrolysis process has a very clean surface and a flat sheet shape. The copper foil itself is roughened on one side, which makes it easier to adhere to other materials. The overall purity of the copper foil is very high, and it has excellent electrical and thermal conductivity. In order to meet the needs of our customers, we can provide not only rolls of copper foil, but also customized slicing services.

Specifications

Thickness: 1/4OZ~20OZ(9µm~70µm)

Width: 550mm ~1295mm

Performance

The product has excellent room temperature storage performance, high temperature oxidation resistance performance, product quality to meet the IPC-4562 standard Ⅱ, Ⅲ level requirements.

Applications

Suitable for all kinds of resin system of double-sided, multilayer printed circuit board.

Advantages

The product adopts a special surface treatment process to improve the product’s ability to resist bottom corrosion and reduce the risk of copper residue.

Performance(GB/T5230-2000、IPC-4562-2000)

Classification

Unit

1/4OZ

(9μm)

1/3OZ

(12μm)

J OZ

(15μm)

1/2OZ

(18μm)

1OZ

(35μm)

2OZ

(70μm)

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

127±4

153±5

283±5

585±10

Tensile Strength

R.T.(25℃)

Kg/mm2

≥28

≥30

H.T.(180℃)

≥15

Elongation

R.T.(25℃)

%

≥4.0

≥5.0

≥6.0

≥10

H.T.(180℃)

≥4.0

≥5.0

≥6.0

Roughness

Shiny(Ra)

μm

≤0.4

Matte(Rz)

≤5.0

≤6.0

≤7.0

≤7.0

≤9.0

≤14

Peel Strength

R.T.(23℃)

Kg/cm

≥1.0

≥1.2

≥1.2

≥1.3

≥1.8

≥2.0

Degraded rate of HCΦ(18%-1hr/25℃)

%

≤5.0

Change of color(E-1.0hr/190℃)

%

Good

Solder Floating 290℃

Sec.

≥20

Pinhole

EA

Zero

Preperg

—-

FR-4

Note: 1. The Rz value of copper foil gross surface is the test stable value, not a guaranteed value.

2. Peel strength is the standard FR-4 board test value (5 sheets of 7628PP).

3. Quality assurance period is 90 days from the date of receipt.


Product detail pictures:

2021 China New Design Copper Insulation Tape - HTE Electrodeposited Copper Foils for PCB – CIVEN detail pictures


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We intention to see quality disfigurement within the creation and supply the ideal support to domestic and overseas buyers wholeheartedly for 2021 China New Design Copper Insulation Tape - HTE Electrodeposited Copper Foils for PCB – CIVEN , The product will supply to all over the world, such as: Mexico, Slovakia, Plymouth, Our staffs are rich in experience and trained strictly, with qualified knowledge, with energy and always respect their customers as the No. 1, and promise to do their best to deliver the effective and individual service for customers. The Company pays attention to maintaining and developing the long-term cooperation relationship with the customers. We promise, as your ideal partner, we'll develop a bright future and enjoy the satisfying fruit together with you, with persisting zeal, endless energy and forward spirit.
  • Staff is skilled, well-equipped, process is specification, products meet the requirements and delivery is guaranteed, a best partner!
    5 Stars By Elaine from Finland - 2017.08.18 11:04
    Wide range, good quality, reasonable prices and good service, advanced equipment, excellent talents and continuously strengthened technology forces,a nice business partner.
    5 Stars By ROGER Rivkin from British - 2018.09.21 11:44
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