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2021 New Style Tin Plated Copper Sheet - ED Copper Foils for FPC – CIVEN

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The company upholds the philosophy of "Be No.1 in quality, be rooted on credit and trustworthiness for growth", will continue to serve old and new customers from home and overseas whole-heatedly for Vlp Copper Foil, Copper Tape Conductive Adhesive, Copper Foil Tape For Soldering, As a key enterprise of this industry, our company makes efforts to become a leading supplier, based on the faith of professional quality & worldwide service.
2021 New Style Tin Plated Copper Sheet - ED Copper Foils for FPC – CIVEN Detail:

Product Introduction

Electrolytic copper foil for FPC is specially developed and manufactured for the FPC industry (FCCL). This electrolytic copper foil has better ductility, lower roughness and better peel strength than other copper foils. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance is also better than similar copper foil products. Since this copper foil is based on the electrolytic process, it does not contain grease, which makes it easier to be combined with TPI materials at high temperatures.

Dimension Range

Thickness: 9µm~35µm

Performances

The product surface is black or red, has lower surface roughness.

Applications

Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.

Features

High density, high bending resistance and good etching performance.

Microstructure

1

SEM(Before Surface Treatment)

2

SEM(Shiny Side after Treatment)

3

SEM(Rough Side after Treatment)

Table1- Performance (GB/T5230-2000、IPC-4562-2000)

Classification

Unit

9μm

12μm

18μm

35μm

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

153±5

283±7

Tensile Strength

R.T.(23℃)

Kg/mm2

≥28

H.T.(180℃)

≥15

≥15

≥15

≥18

Elongation

R.T.(23℃)

%

≥5.0

≥5.0

≥6.0

≥10

H.T.(180℃)

≥6.0

≥6.0

≥8.0

≥8.0

Roughness

Shiny(Ra)

μm

≤0.43

Matte(Rz)

≤2.5

Peel Strength

R.T.(23℃)

Kg/cm

≥0.77

≥0.8

≥0.8

≥0.8

Degraded rate of HCΦ(18%-1hr/25℃)

%

≤7.0

Change of color(E-1.0hr/200℃)

%

Good

Solder Floating 290℃

Sec.

≥20

Appearance(Spot and copper powder)

—-

None

Pinhole

EA

Zero

Size Tolerance

Width

mm

0~2mm

Length

mm

—-

Core

Mm/inch

Inside Diameter 79mm/3 inch

Note: 1. Copper foil oxidation resistance performance and surface density index can be negotiated.

2. The performance index is subject to our testing method.

3. The quality guarantee period is 90 days from the date of receipt.


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2021 New Style Tin Plated Copper Sheet - ED Copper Foils for FPC – CIVEN detail pictures


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With our abundant experience and considerate products and services, we have been recognized to be a reputable supplier for a lot of global consumers for 2021 New Style Tin Plated Copper Sheet - ED Copper Foils for FPC – CIVEN , The product will supply to all over the world, such as: Romania, America, South Korea, We focus on providing service for our clients as a key element in strengthening our long-term relationships. Our continual availability of high grade products in combination with our excellent pre-sale and after-sales service ensures strong competitiveness in an increasingly globalized market. We are willing to cooperate with business friends from at home and abroad and create a great future together.
  • This company conforms to the market requirement and joins in the market competition by its high quality product, this is an enterprise that have Chinese spirit.
    5 Stars By Kelly from Norway - 2018.07.12 12:19
    This manufacturers not only respected our choice and requirements, but also gave us a lot of good suggestions, ultimately, we successfully completed the procurement tasks.
    5 Stars By April from Lyon - 2018.10.31 10:02
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