Competitive Price for High Flex Circuit Board Copper Foil - ED Copper Foils for FPC – CIVEN
Competitive Price for High Flex Circuit Board Copper Foil - ED Copper Foils for FPC – CIVEN Detail:
Product Introduction
Electrolytic copper foil for FPC is specially developed and manufactured for the FPC industry (FCCL). This electrolytic copper foil has better ductility, lower roughness and better peel strength than other copper foils. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance is also better than similar copper foil products. Since this copper foil is based on the electrolytic process, it does not contain grease, which makes it easier to be combined with TPI materials at high temperatures.
Dimension Range
Thickness: 9µm～35µm
Performances
The product surface is black or red, has lower surface roughness.
Applications
Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.
Features
High density, high bending resistance and good etching performance.
Microstructure
SEM(Before Surface Treatment)
SEM(Shiny Side after Treatment)
SEM(Rough Side after Treatment)
Table1- Performance (GB/T5230-2000、IPC-4562-2000)
|
Classification |
Unit |
9μm |
12μm |
18μm |
35μm |
|
|
Cu Content |
% |
≥99.8 |
||||
|
Area Weigth |
g/m2 |
80±3 |
107±3 |
153±5 |
283±7 |
|
|
Tensile Strength |
R.T.(23℃) |
Kg/mm2 |
≥28 |
|||
|
H.T.(180℃) |
≥15 |
≥15 |
≥15 |
≥18 |
||
|
Elongation |
R.T.(23℃) |
% |
≥5.0 |
≥5.0 |
≥6.0 |
≥10 |
|
H.T.(180℃) |
≥6.0 |
≥6.0 |
≥8.0 |
≥8.0 |
||
|
Roughness |
Shiny(Ra) |
μm |
≤0.43 |
|||
|
Matte(Rz) |
≤2.5 |
|||||
|
Peel Strength |
R.T.(23℃) |
Kg/cm |
≥0.77 |
≥0.8 |
≥0.8 |
≥0.8 |
|
Degraded rate of HCΦ(18%-1hr/25℃) |
% |
≤7.0 |
||||
|
Change of color(E-1.0hr/200℃) |
% |
Good |
||||
|
Solder Floating 290℃ |
Sec. |
≥20 |
||||
|
Appearance(Spot and copper powder) |
—- |
None |
||||
|
Pinhole |
EA |
Zero |
||||
|
Size Tolerance |
Width |
mm |
0~2mm |
|||
|
Length |
mm |
—- |
||||
|
Core |
Mm/inch |
Inside Diameter 79mm/3 inch |
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Note: 1. Copper foil oxidation resistance performance and surface density index can be negotiated.
2. The performance index is subject to our testing method.
3. The quality guarantee period is 90 days from the date of receipt.
Product detail pictures:
Related Product Guide:
We thinks what customers think, the urgency of urgency to act in the interests of a customer position of principle, allowing for better quality, lower processing costs, prices are more reasonable, won the new and old customers the support and affirmation for Competitive Price for High Flex Circuit Board Copper Foil - ED Copper Foils for FPC – CIVEN , The product will supply to all over the world, such as: Islamabad, Bulgaria, Greece, We seriously promise that we provide all the customers with the best quality products, the most competitive prices and the most prompt delivery. We hope to win a resplendent future for customers and ourselves.
By Alice from Indonesia - 2018.02.12 14:52
We are long-term partners, there is no disappointment every time, we hope to maintain this friendship later!
By Hilda from Slovakia - 2018.06.12 16:22
