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Low MOQ for Flexible Printed Circuits Copper Foil - Copper Sheet – CIVEN

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Low MOQ for Flexible Printed Circuits Copper Foil - Copper Sheet – CIVEN Detail:

Product Introduction

Copper Sheet is made of electrolytic copper, through processing by ingot, hot rolling, cold rolling, heat treatment, surface cleaning, cutting, finishing, and then packing. The material has excellent thermal and electrical conduction, flexible ductility and good corrosion resistance. It has been widely used in electrical, automotive, communications, hardware, decoration and other industries. 

Main Technical Parameters

1-1 Chemical Composition

Alloy

No.

Chemical Composition (%Max.)

Cu+Ag

P

Bi

Sb

As

Fe

Ni

Pb

Sn

S

Zn

O

Impurity

T1

99.95

0.001

0.001

0.002

0.002

0.005

0.002

0.003

0.002

0.005

0.005

0.02

0.05

T2

99.90

0.001

0.002

0.002

0.005

0.005

0.005

0.002

0.005

0.005

0.06

0.1

TU1

99.97

0.002

0.001

0.002

0.002

0.004

0.002

0.003

0.002

0.004

0.003

0.002

0.03

TU2

99.95

0.002

0.001

0.002

0.002

0.004

0.002

0.004

0.002

0.004

0.003

0.003

0.05

TP1

99.90

0.002

0.002

0.01

0.004

0.005

0.002

0.005

0.005

0.01

0.1

TP2

99.85

0.002

0.002

0.05

0.01

0.005

0.01

0.005

0.01

0.15

1-2 Alloy Table

Name

China

ISO

ASTM

JIS

Pure Copper

T1,T2

Cu-FRHC

C11000

C1100

oxygen-free copper

TU1

——

C10100

C1011

TU2

Cu-OF

C10200

C1020

deoxidized copper

TP1

Cu-DLP

C12000

C1201

TP2

Cu-DHP

C12200

C1220

1-3 Features

1-3-1Specification mm

Name

Alloy(China)

Temper

Size(mm)

Thickness

Width

Length

Copper Sheet

T2/TU2

H  1/4H
1/2H  H

0.3~0.49

600

1000~2000

0.5~3.0

600~1000

1000~3000

Temper Mark:O. Soft;1/4H. 1/4 Hard;1/2H. 1/2 Hard;H. Hard;EH. Ultrahard;R. Hot Rolled.

1-3-2 Tolerance Unit: mm

Thickness

Width

Thickness Allow Deviation±

Width Allow Deviation±

<400

<600

<1000

<400

<600

<1000

0.5~0.8

0.035

0.050

0.080

0.3

0.3

1.5

0.8~1.2

0.040

0.060

0.090

0.3

0.5

1.5

1.2~2.0

0.050

0.080

0.100

0.3

0.5

2.5

2.0~3.2

0.060

0.100

0.120

0.5

0.5

2.5

1-3-3 Mechanical Performance:

Alloy

Temper

Tensile Strength N/mm2

Elongation

%

Hardness

HV

T1

T2

M

(O)

205-255

30

50-65

TU1

TU2

Y4

(1/4H)

225-275

25

55-85

TP1

TP2

Y2

(1/2H)

245-315

10

75-120

 

 

Y

(H)

≥275

3

≥90

Temper Mark:O. Soft;1/4H. 1/4 Hard;1/2H. 1/2 Hard;H. Hard;EH. Ultrahard;R. Hot Rolled.

1-3-4 Electrical Parameters:

Alloy

Conductivity/%IACS

Resistance Coefficient /Ωmm2/m

T1  T2

≥98

0.017593

TU1 TU2

≥100

0.017241

TP1 TP2

≥90

0.019156


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Low MOQ for Flexible Printed Circuits Copper Foil - Copper Sheet – CIVEN detail pictures


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While in the past few years, our organization absorbed and digested innovative technologies both equally at home and abroad. Meanwhile, our organization staffs a group of experts devoted for the advancement of Low MOQ for Flexible Printed Circuits Copper Foil - Copper Sheet – CIVEN , The product will supply to all over the world, such as: Colombia, Curacao, Liberia, We confirm to public, cooperation, win-win situation as our principle, adhere to the philosophy of make a living by quality, keep developing by honesty , sincerely hope to build up a good relationship with more and more customers and friends, to achieve a win-win situation and common prosperity.
  • The goods we received and the sample sales staff display to us have the same quality, it is really a creditable manufacturer.
    5 Stars By Henry stokeld from Morocco - 2017.09.28 18:29
    We are a small company that has just started, but we get the company leader's attention and gave us a lot of help. Hope we can make progress together!
    5 Stars By Chris Fountas from Venezuela - 2018.06.03 10:17
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