Low price for Flexible Copper Clad Laminate - ED Copper Foils for FPC – CIVEN

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With a positive and progressive attitude to customer's interest, our company continuously improves our product quality to meet the needs of customers and further focuses on safety, reliability, environmental requirements, and innovation of Thermal Conductive Foil, Flexible Printed Circuits Copper Foil, Copper Foil Adhesive Tape, Our team members are aim to provides products with high performance cost ratio to our customers, and the goal for all of us is to satisfy our consumers from all over the world.

Low price for Flexible Copper Clad Laminate - ED Copper Foils for FPC – CIVEN Detail:

Product Introduction

Electrolytic copper foil for FPC is specially developed and manufactured for the FPC industry (FCCL). This electrolytic copper foil has better ductility, lower roughness and better peel strength than other copper foils. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance is also better than similar copper foil products. Since this copper foil is based on the electrolytic process, it does not contain grease, which makes it easier to be combined with TPI materials at high temperatures.

Dimension Range

Thickness: 9µm～35µm

Performances

The product surface is black or red, has lower surface roughness.

Applications

Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.

Features

High density, high bending resistance and good etching performance.

Microstructure

SEM(Before Surface Treatment)

SEM(Shiny Side after Treatment)

SEM(Rough Side after Treatment)

Table1- Performance (GB/T5230-2000、IPC-4562-2000)

Classification		Unit	9μm	12μm	18μm	35μm
Cu Content		%	≥99.8
Area Weigth		g/m²	80±3	107±3	153±5	283±7
Tensile Strength	R.T.(23℃)	Kg/mm²	≥28
	H.T.(180℃)		≥15	≥15	≥15	≥18
Elongation	R.T.(23℃)	%	≥5.0	≥5.0	≥6.0	≥10
	H.T.(180℃)		≥6.0	≥6.0	≥8.0	≥8.0
Roughness	Shiny(Ra)	μm	≤0.43
	Matte(Rz)		≤2.5
Peel Strength	R.T.(23℃)	Kg/cm	≥0.77	≥0.8	≥0.8	≥0.8
Degraded rate of HCΦ(18%-1hr/25℃)		%	≤7.0
Change of color(E-1.0hr/200℃)		%	Good
Solder Floating 290℃		Sec.	≥20
Appearance(Spot and copper powder)		—-	None
Pinhole		EA	Zero
Size Tolerance	Width	mm	0~2mm
	Length	mm	—-
Core		Mm/inch	Inside Diameter 79mm/3 inch

Note: 1. Copper foil oxidation resistance performance and surface density index can be negotiated.

2. The performance index is subject to our testing method.

3. The quality guarantee period is 90 days from the date of receipt.

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It is a great way to further improve our products and repair. Our mission is always to create innovative products to prospects with a superior expertise for Low price for Flexible Copper Clad Laminate - ED Copper Foils for FPC – CIVEN , The product will supply to all over the world, such as: Finland, Madras, Mumbai, Now the competition in this field is very fierce; but we will still offer best quality, reasonable price and most considerate service in an endeavor to achieve win-win goal. "Change for the better!" is our slogan, which means "A better world is before us, so let's enjoy it!" Change for the better! Are you ready?

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