Manufactur standard Very Low Profile Copper Foil - Tin Plated Copper Foil – CIVEN

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Manufactur standard Very Low Profile Copper Foil - Tin Plated Copper Foil – CIVEN Detail:

Product Introduction

Copper products exposed in the air are prone to oxidation and the formation of basic copper carbonate, which has high resistance, poor electrical conductivity and high power transmission loss; after tin plating, copper products form tin dioxide films in the air due to the properties of tin metal itself to prevent further oxidation. Tin can also form a similar film in halogen, so that the copper products after plating have good corrosion resistance and weldability, and at the same time have a certain strength and hardness, so they are widely used in electrical and electronic industry products; because tin metal is non-toxic and tasteless, the products after plating are also widely used in the food industry. The tinned copper foil produced by CIVEN METAL has a good surface finish and uniform tin layer thickness. They can be annealed and slit according to customer requirements.

Base Material

● High-precision Rolled Copper Foil, Cu(JIS: C1100/ASTM: C11000) content more than 99.96%

Base Material Thickness Range

● 0.035mm~0.15mm (0.0013 ~0.0059inches)

Base Material Width Range

● ≤300mm (≤11.8 inches)

Base Material Temper

● According to customer requirements

Application

● Electrical appliances and electronics industry, civil (such as: beverage packaging and food contact tools);

Performance Parameters

Items	Weldable Tin Plating	Non-weld Tin Plating
Width Range	≤600mm (≤23.62inches)
Thickness Range	0.012~0.15mm (0.00047inches~0.0059inches)
Tin layer Thickness	≥0.3µm	≥0.2µm
Tin Content of Tin Layer	65~92%(Can adjust tin content according to customer welding process)	100% Pure Tin
Surface Resistance of Tin Layer (Ω)	0.3~0.5	0.1~0.15
Adhesion	5B
Tensile Strength	Base Material Performance Attenuation after Plating ≤10%
Elongation	Base Material Performance Attenuation after Plating ≤6%

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