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New Delivery for Plate Heat Exchange Copper Foil - ED Copper Foils for FPC – CIVEN

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Our mission will be to grow to be an innovative supplier of high-tech digital and communication devices by giving worth added design and style, world-class production, and service capabilities for Decorative Copper Sheets, Brass Metal Strips, Copper Tape Emi Shielding, We warmly welcome customers, business associations and friends from all over the world to contact us and seek cooperation for mutual benefits.
New Delivery for Plate Heat Exchange Copper Foil - ED Copper Foils for FPC – CIVEN Detail:

Product Introduction

Electrolytic copper foil for FPC is specially developed and manufactured for the FPC industry (FCCL). This electrolytic copper foil has better ductility, lower roughness and better peel strength than other copper foils. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance is also better than similar copper foil products. Since this copper foil is based on the electrolytic process, it does not contain grease, which makes it easier to be combined with TPI materials at high temperatures.

Dimension Range

Thickness: 9µm~35µm

Performances

The product surface is black or red, has lower surface roughness.

Applications

Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.

Features

High density, high bending resistance and good etching performance.

Microstructure

1

SEM(Before Surface Treatment)

2

SEM(Shiny Side after Treatment)

3

SEM(Rough Side after Treatment)

Table1- Performance (GB/T5230-2000、IPC-4562-2000)

Classification

Unit

9μm

12μm

18μm

35μm

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

153±5

283±7

Tensile Strength

R.T.(23℃)

Kg/mm2

≥28

H.T.(180℃)

≥15

≥15

≥15

≥18

Elongation

R.T.(23℃)

%

≥5.0

≥5.0

≥6.0

≥10

H.T.(180℃)

≥6.0

≥6.0

≥8.0

≥8.0

Roughness

Shiny(Ra)

μm

≤0.43

Matte(Rz)

≤2.5

Peel Strength

R.T.(23℃)

Kg/cm

≥0.77

≥0.8

≥0.8

≥0.8

Degraded rate of HCΦ(18%-1hr/25℃)

%

≤7.0

Change of color(E-1.0hr/200℃)

%

Good

Solder Floating 290℃

Sec.

≥20

Appearance(Spot and copper powder)

—-

None

Pinhole

EA

Zero

Size Tolerance

Width

mm

0~2mm

Length

mm

—-

Core

Mm/inch

Inside Diameter 79mm/3 inch

Note: 1. Copper foil oxidation resistance performance and surface density index can be negotiated.

2. The performance index is subject to our testing method.

3. The quality guarantee period is 90 days from the date of receipt.


Product detail pictures:

New Delivery for Plate Heat Exchange Copper Foil - ED Copper Foils for FPC – CIVEN detail pictures


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Our enterprise aims to operating faithfully, serving to all of our prospects , and working in new technology and new machine frequently for New Delivery for Plate Heat Exchange Copper Foil - ED Copper Foils for FPC – CIVEN , The product will supply to all over the world, such as: Vietnam, Puerto Rico, Sri Lanka, We welcome you to visit our company, factory and our showroom displayed various products that will meet your expectation, meanwhile, it is convenient to visit our website, our sales staff will try their efforts to provide you the best service. If you need more information, please do not hesitate to contact us by E-mail or telephone.
  • We are long-term partners, there is no disappointment every time, we hope to maintain this friendship later!
    5 Stars By Adelaide from Chile - 2018.09.23 17:37
    The factory technical staff not only have high level of technology, their English level is also very good, this is a great help to technology communication.
    5 Stars By Anna from Brunei - 2018.11.02 11:11
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