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New Delivery for Plate Heat Exchange Copper Foil - ED Copper Foils for FPC – CIVEN

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We insist on offering premium quality creation with very good company concept, honest product sales along with the finest and fast assistance. it will bring you not only the premium quality item and huge profit, but the most significant is to occupy the endless market for Nickel Copper Strip, Copper Foil Adhesive Tape, Cupronickel Foil, We welcome new and old customers from all walks of life to contact us for future business relationships and mutual success!
New Delivery for Plate Heat Exchange Copper Foil - ED Copper Foils for FPC – CIVEN Detail:

Product Introduction

Electrolytic copper foil for FPC is specially developed and manufactured for the FPC industry (FCCL). This electrolytic copper foil has better ductility, lower roughness and better peel strength than other copper foils. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance is also better than similar copper foil products. Since this copper foil is based on the electrolytic process, it does not contain grease, which makes it easier to be combined with TPI materials at high temperatures.

Dimension Range

Thickness: 9µm~35µm

Performances

The product surface is black or red, has lower surface roughness.

Applications

Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.

Features

High density, high bending resistance and good etching performance.

Microstructure

1

SEM(Before Surface Treatment)

2

SEM(Shiny Side after Treatment)

3

SEM(Rough Side after Treatment)

Table1- Performance (GB/T5230-2000、IPC-4562-2000)

Classification

Unit

9μm

12μm

18μm

35μm

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

153±5

283±7

Tensile Strength

R.T.(23℃)

Kg/mm2

≥28

H.T.(180℃)

≥15

≥15

≥15

≥18

Elongation

R.T.(23℃)

%

≥5.0

≥5.0

≥6.0

≥10

H.T.(180℃)

≥6.0

≥6.0

≥8.0

≥8.0

Roughness

Shiny(Ra)

μm

≤0.43

Matte(Rz)

≤2.5

Peel Strength

R.T.(23℃)

Kg/cm

≥0.77

≥0.8

≥0.8

≥0.8

Degraded rate of HCΦ(18%-1hr/25℃)

%

≤7.0

Change of color(E-1.0hr/200℃)

%

Good

Solder Floating 290℃

Sec.

≥20

Appearance(Spot and copper powder)

—-

None

Pinhole

EA

Zero

Size Tolerance

Width

mm

0~2mm

Length

mm

—-

Core

Mm/inch

Inside Diameter 79mm/3 inch

Note: 1. Copper foil oxidation resistance performance and surface density index can be negotiated.

2. The performance index is subject to our testing method.

3. The quality guarantee period is 90 days from the date of receipt.


Product detail pictures:

New Delivery for Plate Heat Exchange Copper Foil - ED Copper Foils for FPC – CIVEN detail pictures


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To constantly improve the management system by virtue of the rule of "sincerely, good faith and quality are the base of enterprise development", we widely absorb the essence of related products internationally, and constantly develop new products to meet the demands of customers for New Delivery for Plate Heat Exchange Copper Foil - ED Copper Foils for FPC – CIVEN , The product will supply to all over the world, such as: French, Argentina, Jamaica, Our domestic website's generated over 50, 000 purchasing orders every year and quite successful for internet shopping in Japan. We would be happy to have an opportunity to do business with your company. Looking forward to receiving your message !
  • Managers are visionary, they have the idea of "mutual benefits, continuous improvement and innovation", we have a pleasant conversation and Cooperation.
    5 Stars By Elaine from Ethiopia - 2017.10.27 12:12
    The sales manager has a good English level and skilled professional knowledge, we have a good communication. He is a warm and cheerful man, we have a pleasant cooperation and we became very good friends in private.
    5 Stars By Karl from Brisbane - 2017.09.30 16:36
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