OEM/ODM China Cu Strip - Shielded ED copper foils – CIVEN

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We can easily usually fulfill our respected customers with our very good top quality, very good price tag and excellent support due to we have been more expert and much more hard-working and do it in cost-effective way for Shielded Copper Foil, Nickel Plated Copper Foil, Circuit Board Copper Foil, Leading the trend of this field is our persistent objective. Supplying first class solutions is our intention. To create a beautiful upcoming, we wish to cooperate with all close friends in the home and overseas. Should you have got any interest in our products and solutions, remember to never wait to call us.

OEM/ODM China Cu Strip - Shielded ED copper foils – CIVEN Detail:

Product Introduction

The electrolytic copper foil for shielding produced by CIVEN METAL can effectively shield electromagnetic signals and microwave interference because of the high purity of copper. The electrolytic production process makes the width of material wider than 1.2 meters(48 inches), which allows for flexible applications in a wide range of fields. The copper foil itself has a very flat shape and can be perfectly molded to other materials. The copper foil is also resistant to high temperature oxidation and corrosion, allowing it to be used in harsh environments or in products where material life is critical.

Specifications

CIVEN can provide 1/4oz-3oz (nominal thickness 9μm -105μm) shielding electrolytic copper foil with a maximum width of 1290mm, or various specifications of shielding electrolytic copper foil with a thickness of 9μm -105μm according to customer requirements with product quality meeting the requirements of IPC-4562 standard II and III.

Performance

It has good moisture resistance, chemical resistance, thermal conductivity and UV resistance, and is suitable for preventing interference with static electricity and electromagnetic waves.

Applications

Mainly used: transformers, cables, cell phones, computers, medical, aerospace, military and other electronic products shielding.

Performance(GB/T5230-2000、IPC-4562-2000)

Classification		Unit	9μm	12μm	18μm	35μm	50μm	70μm	105μm
Cu Content		%	≥99.8
Area Weigth		g/m²	80±3	107±3	153±5	283±7	440±8	585±10	875±15
Tensile Strength	R.T.(23℃)	Kg/mm²	≥28
	H.T.(180℃)		≥15			≥18	≥20
Elongation	R.T.(23℃)	%	≥5.0		≥6.0	≥10
	H.T.(180℃)		≥6.0			≥8.0
Roughness	Shiny(Ra)	μm	≤0.43
	Matte(Rz)		≤3.5
Peel Strength	R.T.(23℃)	Kg/cm	≥0.77	≥0.8	≥0.9	≥1.0	≥1.0	≥1.5	≥2.0
Degraded rate of HCΦ(18%-1hr/25℃)		%	≤7.0
Change of color(E-1.0hr/200℃)		%	Good
Solder Floating 290℃		Sec.	≥20
Appearance(Spot and copper powder)		—-	None
Pinhole		EA	Zero
Size Tolerance	Width	0~2mm	0~2mm
	Length	—-	—-
Core		Mm/inch	Inside Diameter 76mm/3 inch

Note: 1. The Rz value of copper foil gross surface is the test stable value, not a guaranteed value.

2. Peel strength is the standard FR-4 board test value (5 sheets of 7628PP).

3. Quality assurance period is 90 days from the date of receipt.

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