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OEM/ODM Supplier Copper Beryllium Foil - ED Copper Foils for FPC – CIVEN

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Having a positive and progressive attitude to customer's fascination, our organization constantly improves our solution high-quality to fulfill the requirements of shoppers and further focuses on safety, reliability, environmental prerequisites, and innovation of Copper Paper, Brass Metal Strips, Copper Foil Tape, We welcome new and aged buyers from all walks of daily life to get hold of us for upcoming business enterprise interactions and acquiring mutual good results!
OEM/ODM Supplier Copper Beryllium Foil - ED Copper Foils for FPC – CIVEN Detail:

Product Introduction

Electrolytic copper foil for FPC is specially developed and manufactured for the FPC industry (FCCL). This electrolytic copper foil has better ductility, lower roughness and better peel strength than other copper foils. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance is also better than similar copper foil products. Since this copper foil is based on the electrolytic process, it does not contain grease, which makes it easier to be combined with TPI materials at high temperatures.

Dimension Range

Thickness: 9µm~35µm

Performances

The product surface is black or red, has lower surface roughness.

Applications

Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.

Features

High density, high bending resistance and good etching performance.

Microstructure

1

SEM(Before Surface Treatment)

2

SEM(Shiny Side after Treatment)

3

SEM(Rough Side after Treatment)

Table1- Performance (GB/T5230-2000、IPC-4562-2000)

Classification

Unit

9μm

12μm

18μm

35μm

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

153±5

283±7

Tensile Strength

R.T.(23℃)

Kg/mm2

≥28

H.T.(180℃)

≥15

≥15

≥15

≥18

Elongation

R.T.(23℃)

%

≥5.0

≥5.0

≥6.0

≥10

H.T.(180℃)

≥6.0

≥6.0

≥8.0

≥8.0

Roughness

Shiny(Ra)

μm

≤0.43

Matte(Rz)

≤2.5

Peel Strength

R.T.(23℃)

Kg/cm

≥0.77

≥0.8

≥0.8

≥0.8

Degraded rate of HCΦ(18%-1hr/25℃)

%

≤7.0

Change of color(E-1.0hr/200℃)

%

Good

Solder Floating 290℃

Sec.

≥20

Appearance(Spot and copper powder)

—-

None

Pinhole

EA

Zero

Size Tolerance

Width

mm

0~2mm

Length

mm

—-

Core

Mm/inch

Inside Diameter 79mm/3 inch

Note: 1. Copper foil oxidation resistance performance and surface density index can be negotiated.

2. The performance index is subject to our testing method.

3. The quality guarantee period is 90 days from the date of receipt.


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OEM/ODM Supplier Copper Beryllium Foil - ED Copper Foils for FPC – CIVEN detail pictures


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We have now our possess revenue group, design staff, technical crew, QC team and package group. We now have strict excellent regulate procedures for each process. Also, all of our workers are experienced in printing subject for OEM/ODM Supplier Copper Beryllium Foil - ED Copper Foils for FPC – CIVEN , The product will supply to all over the world, such as: Mexico, European, Singapore, We welcome you to visit our company & factory and our showroom displays various products and solutions that will meet your expectations. Meanwhile, it is convenient to visit our website. Our sales staff will try their best to supply you with the best services. If you will need more information, please do not hesitate to contact us via E-mail, fax or telephone.
  • The factory workers have a good team spirit, so we received high quality products fast, in addition, the price is also appropriate, this is a very good and reliable Chinese manufacturers.
    5 Stars By Pearl Permewan from Mali - 2017.04.28 15:45
    The sales person is professional and responsible, warm and polite, we had a pleasant conversation and no language barriers on communication.
    5 Stars By Abigail from Georgia - 2017.12.19 11:10
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