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Professional Design Emc Copper Foil - ED Copper Foils for FPC – CIVEN

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Our organization promises all customers with the first-class products and solutions and the most satisfying post-sale service. We warmly welcome our regular and new clients to join us for Black Back Copper Foil, Insulated Copper Strip, High Flex Circuit Board Copper Foil, We welcome customers, business associations and friends from all parts of the world to contact us and seek cooperation for mutual benefits.
Professional Design Emc Copper Foil - ED Copper Foils for FPC – CIVEN Detail:

Product Introduction

Electrolytic copper foil for FPC is specially developed and manufactured for the FPC industry (FCCL). This electrolytic copper foil has better ductility, lower roughness and better peel strength than other copper foils. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance is also better than similar copper foil products. Since this copper foil is based on the electrolytic process, it does not contain grease, which makes it easier to be combined with TPI materials at high temperatures.

Dimension Range

Thickness: 9µm~35µm

Performances

The product surface is black or red, has lower surface roughness.

Applications

Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.

Features

High density, high bending resistance and good etching performance.

Microstructure

1

SEM(Before Surface Treatment)

2

SEM(Shiny Side after Treatment)

3

SEM(Rough Side after Treatment)

Table1- Performance (GB/T5230-2000、IPC-4562-2000)

Classification

Unit

9μm

12μm

18μm

35μm

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

153±5

283±7

Tensile Strength

R.T.(23℃)

Kg/mm2

≥28

H.T.(180℃)

≥15

≥15

≥15

≥18

Elongation

R.T.(23℃)

%

≥5.0

≥5.0

≥6.0

≥10

H.T.(180℃)

≥6.0

≥6.0

≥8.0

≥8.0

Roughness

Shiny(Ra)

μm

≤0.43

Matte(Rz)

≤2.5

Peel Strength

R.T.(23℃)

Kg/cm

≥0.77

≥0.8

≥0.8

≥0.8

Degraded rate of HCΦ(18%-1hr/25℃)

%

≤7.0

Change of color(E-1.0hr/200℃)

%

Good

Solder Floating 290℃

Sec.

≥20

Appearance(Spot and copper powder)

—-

None

Pinhole

EA

Zero

Size Tolerance

Width

mm

0~2mm

Length

mm

—-

Core

Mm/inch

Inside Diameter 79mm/3 inch

Note: 1. Copper foil oxidation resistance performance and surface density index can be negotiated.

2. The performance index is subject to our testing method.

3. The quality guarantee period is 90 days from the date of receipt.


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Professional Design Emc Copper Foil - ED Copper Foils for FPC – CIVEN detail pictures


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We constantly continually give you essentially the most conscientious client provider, plus the widest variety of designs and styles with finest materials. These initiatives include the availability of customized designs with speed and dispatch for Professional Design Emc Copper Foil - ED Copper Foils for FPC – CIVEN , The product will supply to all over the world, such as: India, Munich, Adelaide, Our items are widely recognized and trusted by users and can meet continuously developing economic and social needs. We welcome new and old customers from all walks of life to contact us for future business relationships and achieving mutual success!
  • The enterprise has a strong capital and competitive power, product is sufficient, reliable, so we have no worries on cooperating with them.
    5 Stars By Ruth from Luxembourg - 2018.06.12 16:22
    This is a honest and trustworthy company, technology and equipment are very advanced and the prodduct is very adequate, there is no worry in the suppliment.
    5 Stars By Daphne from Malta - 2017.09.22 11:32
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