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Rapid Delivery for Fccl Copper Foil - RTF ED Copper Foil – CIVEN

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Rapid Delivery for Fccl Copper Foil - RTF ED Copper Foil – CIVEN Detail:

Product Introduction

Reverse treated electrolytic copper foil (RTF) is a copper foil that has been roughened to varying degrees on both sides. This strengthens the peel strength of both sides of the copper foil, making it easier to use as an intermediate layer for bonding to other materials. Moreover, the different levels of treatment on both sides of the copper foil make it easier to etch the thinner side of the roughened layer. In the process of making a printed circuit board (PCB) panel, the treated side of the copper is applied to the dielectric material. The treated drum side is rougher than the other side, which constitutes a greater adhesion to the dielectric. This is the main advantage over standard electrolytic copper. The matte side does not require any mechanical or chemical treatment prior to the application of photoresist. It is already rough enough to have good laminating resist adhesion.

Specifications

CIVEN can supply RTF electrolytic copper foil with nominal thickness of 12 to 35µm up to 1295mm width.

Performance

The high temperature elongation reversed treated electrolytic copper foil is subjected to a precise plating process to control the size of the copper tumors and distribute them evenly. The reversed treated bright surface of the copper foil can significantly reduce the roughness of the copper foil pressed together and provide sufficient peel strength of the copper foil. (See Table 1)

Applications

Can be used for high-frequency products and inner laminates, such as 5G base stations and automotive radar and other equipment.

Advantages

Good bonding strength, direct multi-layer lamination, and good etching performance. It also reduces the potential for short circuit and shortens the process cycle time.

Table 1. Performance

Classification

Unit

1/3OZ

(12μm)

1/2OZ

(18μm)

1OZ

(35μm)

Cu Content

%

min. 99.8

Area Weigth

g/m2

107±3

153±5

283±5

Tensile Strength

R.T.(25℃)

Kg/mm2

min. 28.0

H.T.(180℃)

min. 15.0

min. 15.0

min. 18.0

Elongation

R.T.(25℃)

%

min. 5.0

min. 6.0

min. 8.0

H.T.(180℃)

min. 6.0

Roughness

Shiny(Ra)

μm

max. 0.6/4.0

max. 0.7/5.0

max. 0.8/6.0

Matte(Rz)

max. 0.6/4.0

max. 0.7/5.0

max. 0.8/6.0

Peel Strength

R.T.(23℃)

Kg/cm

min. 1.1

min. 1.2

min. 1.5

Degraded rate of HCΦ(18%-1hr/25℃)

%

max. 5.0

Change of color(E-1.0hr/190℃)

%

None

Solder Floating 290℃

Sec.

max. 20

Pinhole

EA

Zero

Preperg

—-

FR-4

Note: 1. The Rz value of copper foil gross surface is the test stable value, not a guaranteed value.

2. Peel strength is the standard FR-4 board test value (5 sheets of 7628PP).

3. Quality assurance period is 90 days from the date of receipt.


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It is a great way to further improve our products and repair. Our mission is always to create innovative products to prospects with a superior expertise for Rapid Delivery for Fccl Copper Foil - RTF ED Copper Foil – CIVEN , The product will supply to all over the world, such as: Czech Republic, Armenia, Poland, Due to our good products and services, we have received good reputation and credibility from local and international customers. If you need more information and are interested in any of our products, please feel free to contact us. We look forward to becoming your supplier in the near future.
  • Reasonable price, good attitude of consultation, finally we achieve a win-win situation,a happy cooperation!
    5 Stars By Edwina from Turkey - 2018.12.22 12:52
    The company comply with the contract strict, a very reputable manufacturers, worthy a long-term cooperation.
    5 Stars By Nina from Nigeria - 2018.12.05 13:53
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