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Special Design for Flexible Circuit Board Copper Foil - 3L Flexible Copper Clad Laminate – CIVEN

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Special Design for Flexible Circuit Board Copper Foil - 3L Flexible Copper Clad Laminate – CIVEN Detail:

Product Introduction

In addition to the advantages of thin, light and flexible, FCCL with polyimide based film also has excellent electrical properties, thermal properties, and heat resistance characteristics. Its low dielectric constant (DK) makes electrical signals transmit rapidly. Good thermal performance makes the components easy to cool down. The higher glass transition temperature (Tg) allows the components to operate well at higher temperatures. Since most of the products of FCCL are provided to users in continuous roll form, therefore, the use of FCCL in the production of printed circuit boards is beneficial to the realization of automatic continuous production of FPC and the continuous surface installation of components on FPC.

Flexible copper clad laminate (also known as flexible copper clad laminate) is the processing substrate material of flexible printed circuit board. It is composed of flexible insulating base film and metal foil. The flexible copper clad laminate composed of copper foil, film and adhesive is called three-layer flexible copper clad laminate (3l-fccl for short). The flexible copper clad laminate without adhesive is called two-layer flexible copper clad laminate (2L-FCCL for short)

Flexible copper clad laminate (FCCL) has the characteristics of thin, light and flexible compared with rigid copper clad laminate. FPC with FCCL as substrate material is widely used in mobile phones, digital cameras, digital cameras, automotive satellite orientation devices, LCD TVs, laptops and other electronic products.

Specifications

Product name

Product code

Structure

3L FCCL

MG3L 181513

18μm Copper foil | 15μm EPOXY Adhesive | 13μm PI film

3L FCCL

MG3L 181313

 18μm Copper foil | 13μm EPOXY Adhesive | 13μm PI film

Multilayer FCCL

MG3LTC 352025

   35μm Copper foil | 20μm EPOXY Adhesive | 25μm PI film | 20μm EPOXY Adhesive | 35μm Copper foil

Multilayer FCCL

MG3LTC 121513

   12μm Copper foil | 15μm EPOXY Adhesive | 13μm PI film | 15μm EPOXY Adhesive | 12μm Copper foil

Product Performance

● Excellent peel resistance

● Excellent heat resistance

● Good dimensional stability

● Excellent mechanical and electrical properties

● Flame retardant UL94V-0/VTM-0

● Meet the RoHS directive requirements, free of lead (Pb), mercury (Hg), cadmium (GR), hexavalent chromium (Cr), polybrominated biphenyls, polybrominated biphenyls, etc

Product Application

Mainly used in computers, notebook computers, mobile phones and antennas, backlight modules, flat panel display, capacitive screen, digital cameras, cameras, printers, instruments and meters, automotive electronics, automotive audio, automotive, Note Book connectors, Harmony Bus and other high-end electronic products.


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Special Design for Flexible Circuit Board Copper Foil - 3L Flexible Copper Clad Laminate – CIVEN detail pictures


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Using a complete scientific top quality management program, great high-quality and fantastic religion, we win great track record and occupied this area for Special Design for Flexible Circuit Board Copper Foil - 3L Flexible Copper Clad Laminate – CIVEN , The product will supply to all over the world, such as: Wellington, Salt Lake City, Colombia, We guarantee that our company will try our best to reduce customer purchase cost , shorten the period of purchase , stable merchandise quality , increase customers' satisfaction and achieve win-win situation .
  • The goods we received and the sample sales staff display to us have the same quality, it is really a creditable manufacturer.
    5 Stars By Edward from Norway - 2017.08.18 11:04
    We have been cooperated with this company for many years, the company always ensure timely delivery ,good quality and correct number, we are good partners.
    5 Stars By Honorio from Detroit - 2017.09.29 11:19
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