Productes CIVEN

Un fotil de cobra especial que manté excel·lent elongació a la temperatura alta (180 °C): la seva elongació d' alta temperatura és almenys 30% del valor de la temperatura de l'habitació. La laminació de PCB multicapa genera una gran quantitat d'energia tèrmica i la fulla de coure ordinària tendeix a recristal·litzar-se, provocant "esquerdes de coure" en els circuits de les capes interiors. HTE resol aquest problema mitjançant una composició d'allotjament especial i un procés de tractament tèrmic. És una de les categories d'adhesius de coure d'alta gamma amb la major quota de mercat a la Xina i s'utilitza ampliament en plques multicapa i laminats de Tg elevada.

The shiny side of the electrodeposited foil is also roughened, giving both sides good bonding strength. The two sides are treated to different degrees: the side facing the dielectric is rougher for better adhesion, while the other side is thinner for easier etching. When used as inner-layer foil in multilayer boards, it eliminates the black-oxide treatment before lamination, improving production efficiency. It is one of the mainstream choices for high-frequency, high-speed copper clad laminates, balancing performance and cost.

A transitional product that first brought surface roughness down to the 3–4 μm level. Its fine crystal structure (< 2 μm) consists of equiaxed grains rather than conventional columnar crystals, with layered crystallization and flat ridges. Compared with STD and RTF, signal transmission loss is significantly lower, making it a cost-effective entry into high-speed circuits. No copper powder transfer residue after etching, and better surface and insulation resistance.

Ultra-smooth copper foil with surface roughness ≤ 2 μm, produced by precision electrodeposition. Both sides reach very low roughness, and the fine equiaxed grain structure ensures isotropy. It greatly reduces conductor loss caused by the skin effect, with Df optimizable to ≤ 0.002, and bonds excellently with low-loss substrates such as PTFE and hydrocarbon resins. It is the mainstay material for high-frequency, high-speed applications such as 5G communications and AI servers.

The smoothest surface among today's commercial copper foils, with Rz as low as 1–1.5 μm or even lower. Building on VLP, it approaches the physical limit of roughness and is designed for mmWave above 28 GHz and ultra-high-speed interconnects in AI training clusters. A single high-end AI server can use up to ten times as much HVLP as a conventional server. As global computing infrastructure expands, supply remains tight.

Electrodeposited copper foil dedicated to lithium-ion battery anode current collectors and one of the core base materials of lithium batteries. Unlike PCB copper foil, BCF has a double-shiny (bright on both sides) surface finish and is soft enough for battery winding processes, while offering excellent chemical and electrochemical stability. Thinner foil is the key path to higher energy density: reducing thickness from 12 μm to 6 μm or even 4–5 μm directly cuts battery weight by about 5–9% and lowers internal resistance, improving charge-discharge efficiency.